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SDI03K
特點(diǎn)
● 無(wú)鉛兼容
● 高Tg無(wú)鹵，Tg190℃ (DMA)● UV阻擋/AOI兼容
● 良好的尺寸穩定性
應用領(lǐng)域
● 適用于智能手機，筆記本電腦，平板電腦，SSD, DDR, 汽車(chē)電子，儀表盤(pán)，錄像機，電視，電子游戲機，通訊設備等
- 產(chǎn)品性能
- 產(chǎn)品證書(shū)
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.2 | DMA | ℃ | 190 |
| 2.4.24 | TMA | 165 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 390 |
|
T288 |
2.4.24.1 | TMA | min |
＞60 |
| T260 |
2.4.24.1 |
TMA |
min |
＞60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 30 |
| After Tg | ppm/℃ | 190 | ||
| 50-260℃ | % | 2.1 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50 | - | 3.38 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.0072 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 3.87×109 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 1.72×107 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 182 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | ＞45 |
|
Peel Strength (H Oz) |
2.4.8 |
288℃/10s |
N/mm |
0.95 |
|
Flexural Strength (LW/CW) |
2.4.4 |
A |
MPa |
510/490 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.06 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
1. Specification sheet: IPC-4101/130, is for your reference only.2. All the typical values listed above are for your reference only, Please contact Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.