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S1125
特點(diǎn)
● 不含鹵素，Dicy 固化 普通Tg 。
● 不含銻、紅磷等成分。
● 優(yōu)異的表面粘結性。
應用領(lǐng)域
手機、電腦、儀器儀表、攝錄機、通訊設備等- 產(chǎn)品性能
- 產(chǎn)品證書(shū)
- 資料下載
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 130 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 350 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 40 | |
|
After Tg |
ppm/℃ | 235 | |||
| 50-260℃ |
% |
3 | |||
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 30 | |
| Thermal Stress | IPC-TM-650 2.4.24.13 | 288℃, solder dip | -- | >100S | |
| Flexural strength |
IPC-TM-650 2.4.4 |
A |
Mpa |
580/LW | |
| A |
Mpa |
450/CW | |||
| Peel Strength | IPC-TM-650 2.4.8 | Copper (1/2 oz) | N/mm | 1.2 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
| Flammability | UL94 |
E-24/125 |
Rating |
V-0 |
|
Remarks:
1. Performance data based on the sample S1125 0.30mm test results.
2.The test method of PS: superposition the ED copper foil (1Oz),bonding film, S1125, then laminate them, using the pararmeters 170℃, 200PSI, 40 minutes. Using 90 degree angle peelling.
3. All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.