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SF315C
特點(diǎn)
● 透明度低，遮光性佳。
● 粘結強度高，尺寸穩定性好。
● 阻燃性達到UL94 V-0級。
● 優(yōu)秀的耐熱性、耐化學(xué)性和電性能。
● 溢膠量低，加工性好，適于快速壓合和傳統壓合。
● 滿(mǎn)足RoHS指令要求，不含鉛、汞、鎘、六價(jià)鉻、多溴聯(lián)苯、多溴聯(lián)苯醚等。
應用領(lǐng)域
撓性印制電路板用覆蓋膜- 產(chǎn)品性能
- 產(chǎn)品證書(shū)
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.25 |
| 288℃, 5s | 1.28 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Dimensional Stability | SY Method |
After peeling off the paper |
% | -0.0325/-0.0538 |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
＞85 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
5.31×108 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
4.5×106 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 3.5 |
| Dissipation Factor (10GMHz) | SPDR |
C-24/23/50 |
- | 0.017 |
| Resin Flow | IPC-TM-650 2.3.17.1 |
180℃/10+60s,100kg/cm2 |
mm | ＜0.15 |
| Flammability | UL94 |
E-24/125 |
Rating |
V-0 |
Remarks:
*Testing after laminating with shining side of copper foil in suitablecondition
1.Certified to IPC-4203/2 Epoxy adhesive on one or two sides of poyimidedielectric
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.