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EN/CN

Product

BIF201

Characteristic


●  Excellent bonding strength,heat resistance, dimensional stability,bending performance and insulation performance.

●  Halogen-free and flammabilityUL94 VTM-0.

●  Low adhesive flowing, good processability,suitable forboth fast and traditional lamination style,can be repaired ,Storage at roomtemperature

●  Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE,etc..


Application Area

Insulation bonding sheet for laminated busbars.


  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Peel Strength(90°)* IPC-TM-650 2.4.9D Accepted N/mm 1.8
Solder Resistance IPC-TM-650 2.4.13.F 288℃、10s -

No delamination

Dimensional Stability IPC-TM-650 2.2.4c E-0.5/150 % -0.3/-0.45
Electric Strength IPC-TM-650 2.5.6.2A D-48/50+D-0.5/23 KV/mm 47
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 8.4×108
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
1.5×106
Dielectric Constant(10GHz) SPDR C-24/23/50 - 3.5
Dissipation Factor(10GHz) SPDR C-24/23/50
- 0.02
Flammability UL94 E-24/125
Rating VTM-0

Remarks:

*Testingafter laminating with treatment side of  35μm ED copper foil in suitable condition.

All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

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