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金屬基板與高導熱產(chǎn)品
>鋁基板
SAR30
特點(diǎn)
● 無(wú)鹵，高CTI
● 導熱系數 3.0 W/(m·K)
● 高剝離強度
● 優(yōu)異的耐熱性和絕緣能力
應用領(lǐng)域
● 大功率LED照明
● 電源板
● 車(chē)載照明
- 產(chǎn)品性能
- 產(chǎn)品證書(shū)
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Thermal Conductivity | ASTM-D5470 | A | W/ (m?K) | 3.0 |
| Thermal Resistance | ASTM-D5470 | A | K·cm2/W | 0.34 |
| Tg | 2.4.25D | DSC | ℃ | 155 |
|
Td |
2.4.24.6 | Wt 5% loss | ℃ | 400 |
| Thermal Stress | 2.4.13.1 | 288℃, solder float |
min |
30 |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 20 |
| After Tg | ppm/℃ | 31 | ||
| 50-260℃ | % | 0.48 | ||
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 108 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 108 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | 5.0 |
| Hi-pot Test |
GB/T-31988 |
DC | V | 4000 |
| AC | V | 3000 | ||
| Peel Strength (1oz) | 2.4.8 | 288℃/10s | N/mm | 1.15 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
| MOT | UL | A | ℃ | 130 |
| CTI | IEC60112 | A | Rating | PLC 0 |
Remarks:
1. Typical value is based on specimen of 1.5mm Al/100μm dielectric/1oz Cu.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.