Items		Method	Condition	Unit	Typical Value
Tg		IPC-TM-650 2.4.25	DSC	℃	122
CTE (Z-axis)		IPC-TM-650 2.4.24	Before Tg	ppm/℃	28
			After Tg	ppm/℃	265
			50-260℃	%	3.5
Thermal Stress		IPC-TM-650 2.4.13.1	288℃, solder dip	s	>30
Volume Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ.cm	5.7x 108
			E-24/125	MΩ.cm	6.3 x 106
Surface Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ	6.7 x 107
			E-24/125	MΩ	3.5 x 106
Arc Resistance		IPC-TM-650 2.5.1	D-48/50+D-4/23	s	140
Dielectric Breakdown		IPC-TM-650 2.5.6	D-48/50+D-4/23	kV	>45
Dielectric Constant (Dk)		IPC-TM-650 2.5.5.9	1MHz	--	4.8
Dissipation Factor (Df)		IPC-TM-650 2.5.5.9	1MHz	--	0.014
Peel Strength (1oz HTE copper foil)		IPC-TM-650 2.4.8	A	N/mm	—
			After thermal Stress 288℃,10s	N/mm	1.9
			125℃	N/mm	1.7
Flexural Strength	LW	IPC-TM-650 2.4.4	A	MPa	410
	CW	IPC-TM-650 2.4.4	A	MPa	340
Water Absorption		IPC-TM-650 2.6.2.1	E-1/105+D-24/23	%	0.13
Thermal Conductivity		ASTM 5470	A	W/m·K	1.0
CTI		IEC60112	A	Rating	PLC 0
Flammability		UL94	C-48/23/50	Rating	V-0
			E-24/125	Rating	V-0

Remarks:

1. Specification sheet: IPC-4101/12, is for your reference only.

2. All the typical value is based on the 1.0mm 1oz/1oz specimen.

3. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.