Product
S7439G
Characteristic
● Tg 189℃ (DMA)● Dk/Df@10GHz: 3.74/0.0060
● Td>400℃, T300＞60min
● low Z-axis CTE with good processibility
● Low moisture absorption and excellent thermal reliability
● Lead-free CompatibleApplication Area
● Networking equipment (Routers, servers, switches)● High performance computers
● Base Station backplane, line card
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg |
IPC-TM-650 2.4.24.4 |
DMA |
℃ |
189 | |
|
IPC-TM-650 2.4.25D |
DSC |
℃ |
181 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 405 | |
| T288 |
IPC-TM-650 2.4.24.1 |
TMA |
min | 60 | |
| T300 |
IPC-TM-650 2.4.24.1 |
TMA | min | 60 | |
| Thermal Stress |
IPC-TM-650 2.4.13.1 |
288℃, solder dip | s | 100 | |
| CTE（Z-axis） | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
| After Tg | ppm/℃ | 225 | |||
| 50-260℃ | % | 2.5 | |||
|
Dielectric Constant (Dk) |
IPC-TM-650 2.5.5.9 | 1GHz | -- | 3.93 | |
| IPC-TM-650 2.5.5.5 | 10GHz | -- | 3.74 | ||
|
IEC 61189-2-721 |
10GHz | -- | 4.08 | ||
|
Dissipation Factor (Df) |
IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.0043 | |
|
|
IPC-TM-650 2.5.5.5 | 10GHz | -- | 0.0060 | |
|
|
IEC 61189-2-721 |
10GHz | -- | 0.0070 | |
| Volume Resistivity |
IPC-TM-650 2.5.17.1 |
C-96/35/90 |
MΩ-cm | 9.0×108 | |
| Surface Resistivity |
IPC-TM-650 2.5.17.1 |
C-96/35/90 |
MΩ | 2.0×107 | |
| Peel Strength (1Oz RTF copper foil) | IPC-TM-650 2.4.8 |
After thermal Stress 288℃,10s |
N/mm [lb/in] |
0.90 [7.0] |
|
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Remarks:
1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.